Detailed Specification |
|
CPU |
2 4th Generation Intel®Xeon® Sapphire Rapids / 5th Generation Intel®Xeon® Emerald Rapids SP series 64 Cores for each Processor and 385W power consumption HBM technology |
Chipset |
Intel®C741 |
Memory |
32 DDR5 RDIMM Slots, 5600 MT/s Data Rate, 8TB on 2 CPU Configuration with 256G DDR5 RDIMM |
Raid Controller |
Dedicated PCIe HBA Controller or Raid Controller* Standard PCIe HBA Controller or Raid Controller |
FBWC |
8 GB Cache, support Supercapacitor protection |
Storage |
Front 10SFF bays, Rear 2SFF bays Front 4LFF bays SAS/SATA HDD/SSD Drives,12 U.2 NVMe Drives SATA/NVMe M.2 Kit, DSD module (2 x SD card kit) |
Network |
1 Onboard 1Gbps Management Network Port 2 Onboard OCP 3.0 Slots for 4 GE or 2 10GE or 2 25GE or 2 100GE NICs PCIe Standard Slots for 1/10/25/100GE Ethernet Adapter, IB card |
Expansion Slots |
4 PCIe Standard Slots (3 PCIe5.0 and 1 PCIe4.0) and 2 Onboard OCP 3.0 Slots; CXL1.1 |
Ports |
Standard: 2 VGA Port (1 Front, 1 Rear), 3 USB 3.0 Ports (1 Front, 2 Rear), 1 USB 2.0 Internal Port, 1 Front Type-C port Optional: 1 Rear Management Port |
GPU |
4 Single-Slot GPU Modules |
Optical Drive |
External Optical Disk Drive, Optional |
Management |
HDM Management System (with dedicated management port) H3C iFIST/UniSystem, LCD touchable model,64M Video Cache |
Security |
Intelligent Front Security Bezel * Chassis Intrusion Detection TPM2.0 Silicon Root of Trust 2FA for HDM Intel SGX2.0 and PFR3.0 |
Power supply |
1+1 Redundancy power supply Titanium 1600W Platinum 800W/1300W/1600W/2000W DC power supply 8 Hot swappable Redundant Fans |
Standards |
CE,UL , FCC,VCCI,CB, etc. |
Operating temperature |
5°C to 45°C (41°F to 113°F) * |
Dimensions (H × W × D) |
1U Height Without a security bezel: 42.9 x 434.6 x 777 mm (1.68 x 17.11 x 30.59 in) With a security bezel: 42.9 x 434.6 x 805 mm (1.68 x 17.11 x 31.7 in) |